Editorial summary

The company is seeking an R&D Engineer specializing in C/A (Chip Attach) and TCB (Thermal Compression Bonding) to lead the development and optimization of advanced bonding processes and equipment for next-generation packaging technologies such as chiplet integration and 2.5D/3D architectures. The role involves establishing robust bonding recipes, ensuring precise alignment and co-planarity, and advancing TC bonder tools from concept validation to qualification. Candidates should have expertise in advanced thermal compression bonding processes, process development, and hardware qualification. The position offers a salary of 6,000.

This summary is AI-generated and may contain inaccuracies. Please refer to the full job description below.

Job description

[This job id 24330 first appeared in Job-Q.com on 07 Aug 2026]

• To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures).
• To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.
• Advanced TC Bonding Process development for CoWoS PKG product family and CPO
• Tool & Hardware Development / Qualification
• Warpage & Co-planarity Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield Failure Analysis (FA)

Required Experience and Qualifications:

• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes
• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
• Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Ability to prepare technical documents and deliver presentations to internal and external stakeholders
• Proficiency in reading and writing technical documents in English
• Salary up to $6000
• Location: Yishun
• Mon To Fri 8am -518pm

JOB ID: GTJK009

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Kindly email your resume in a detailed Word format to

We regret that only shortlisted candidates will be notified

People Profilers Pte Ltd

• 20 Cecil Street, #08-09, Plus Building, Singapore 049705
• Tel: 69509745
• EA Licence Number: 02C4944
• EA Registration Number: R1108448
• EA Personnel: Tan Lili Gesse

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