Editorial summary

The company is seeking a Senior Advanced Packaging Application Engineer specializing in Thermo Compression Bonding (TCB) and flip chip assembly. The role involves understanding customer packaging roadmaps, translating process requirements into equipment specifications, and supporting technical discussions and sales activities. The position is based at Admirax Street, with a work schedule of Monday to Friday from 9:00 am to 6:00 pm. The salary ranges from SGD 8,000 to SGD 10,000 per month, depending on experience and technical capability.

This summary is AI-generated and may contain inaccuracies. Please refer to the full job description below.

Job description

[This job id 28470 first appeared in Job-Q.com on 29 Aug 2026]

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

• Location: Admirax St
• Working Days:  5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

- Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements: 

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

- Minimum 5 years experience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.

Interested Personal kindly contact WhatsApp :+65 8833 7969(Lydia)
OR
Email to :
The Supreme HR Advisory Pte Ltd
Reg No: R1988890
EA No: 14C7279

Scam prevention reminder: You should not make any pre-payment when applying for any job.

Illegal practices reminder: It is illegal for recruiter to collect payment (kickback) from the worker https://www.mom.gov.sg/-/media/mom/documents/publications/foreign-workers/what-are-kickbacks.pdf