Editorial summary

The company is seeking an Application / Process Engineer specializing in Die Bond Tools, responsible for developing, optimizing, and validating die bonding processes and equipment. The role involves setting up, calibrating, troubleshooting machinery, and collaborating with cross-functional teams to improve products and processes. Candidates should have technical expertise in process development and equipment management. The position offers a monthly salary of up to $6,000 and is based in Woodlands, with working hours from Monday to Friday, 9 am to 6 pm.

This summary is AI-generated and may contain inaccuracies. Please refer to the full job description below.

Job description

[This job id 28188 first appeared in Job-Q.com on 28 Aug 2026]

Application / Process Engineer (Die Bond Tools)

$3,000 – $6,000

Monday – Friday, 9am – 6pm

Woodlands

Job Responsibilities

• Develop, optimize and validate die bonding processes, applications and equipment.
• Set up, calibrate and qualify machines to achieve optimum performance and production yield.
• Troubleshoot equipment and process issues, and implement corrective actions.
• Develop process recipes, test procedures and technical documentation.
• Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
• Provide technical support, equipment installation and application support at customer sites.
• Conduct customer training and support Field Application Engineers on equipment operation.
• Liaise with customers to understand application requirements and recommend suitable semiconductor packaging solutions.
• Gather customer feedback and work with the R&D team on product improvements.

Requirements

• Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or a related discipline.
• Semiconductor manufacturing experience is required.
• Minimum 3 years of experience in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.
• Good knowledge of advanced semiconductor packaging technologies (e.g. Flip Chip, PoP, WLP and PLP).
• Experience with semiconductor equipment, motion control systems and process development is an advantage.
• Hands-on troubleshooting and problem-solving experience in a manufacturing or laboratory environment.
• Good communication skills and able to work independently as well as in a team.
• Willing to travel for customer support, equipment installation and on-site technical assistance when required.

Company Name: Talent Recruitment Pte Ltd

EA License No: 24C2338

EA Personnel Name: Loke Sai Lye (Loke)

EA Personnel No: R24123366

Email:

Contact Number: 81688648

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