Editorial summary
The company is seeking a Senior Advanced Packaging Application Engineer in the semiconductor manufacturing sector, based in Sembawang. The role involves understanding customer packaging roadmaps, translating process requirements into equipment specifications, and supporting technical discussions and sales activities. The position offers a salary range of SGD 8,000 to SGD 10,000 per month, depending on experience and technical capability, with a standard workweek of five days from 9:00 am to 6:00 pm.
This summary is AI-generated and may contain inaccuracies. Please refer to the full job description below.
Job description
[This job id 25477 first appeared in Job-Q.com on 14 Aug 2026]
WhatsApp: +65 90820021 (Kyler)
Email:
Location: Sembawang
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).
Responsibilities:
Customer Application Engineering
- Understand customer packaging roadmaps and manufacturing requirements.
- Translate process requirements into equipment specifications.
- Participate in customer technical discussions and application reviews.
- Support technical sales activities and customer demonstrations.
- Gather customer feedback and recommend future product enhancements.
Advanced Packaging Process Development
-Develop and support applications involving:
- Thermo Compression Bonding (TCB)
- Flip Chip Assembly
- Hybrid Bonding
- HBM Packaging
- CoWoS
- CoPoS
- 2.5D Packaging
- 3D Packaging
- Chiplet Integration
- Large Die Packaging
-Evaluate and optimize:
- Bond force
- Temperature profiles
- Process windows
- Alignment accuracy
- Package warpage
- Yield
- Reliability
Equipment Development
-Work closely with multidisciplinary engineering teams to define:
- Machine architecture
- Functional specifications
- Accuracy requirements
- Throughput targets
- Thermal performance
- Bonding process capability
- Reliability requirements
- Customer acceptance criteria
Provide technical guidance throughout equipment development.
Machine Qualification
Serve as the internal customer during equipment development.
Responsibilities include:
- Defining machine acceptance criteria
- Process qualification
- FAT and SAT support
- Customer buyoff support
- Qualification reporting
- Continuous performance improvement
Technology & Market Intelligence
Monitor industry developments in:
- Advanced packaging technologies
- Semiconductor manufacturing trends
- Customer requirements
- Competitor equipment
- Emerging packaging architectures
Support future product strategy and technology roadmap planning.
Requirements:
- Bachelor's or Master's Degree in:
- Materials Engineering
- Mechanical Engineering
- Electrical Engineering
- Chemical Engineering
- Physics
- Semiconductor Engineering
- Related Engineering disciplines
-Minimum 5 years experience in semiconductor advanced packaging.
-Hands-on experience in one or more of the following:
- Thermo Compression Bonding (TCB)
- Advanced Packaging Process Development
- Flip Chip Assembly
- New Product Introduction (NPI)
- Process Qualification
- Equipment Qualification
- Manufacturing Engineering
- Customer Process Development
- Experience supporting advanced package technologies such as:
- HBM
- CoWoS
- CoPoS
- Chiplets
- 2.5D Packaging
- 3D Packaging
- Large Die Packaging
- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.
- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.
- Strong understanding of:
- Thermo Compression Bonding (TCB)
- Semiconductor Packaging
- Flip Chip Assembly
- Process Qualification
- SPC
- DOE
- Yield Improvement
- Reliability Testing
- Failure Analysis
- Package Warpage
- Thermal Management
- Alignment Accuracy
- Semiconductor Manufacturing Processes
- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.
The Supreme HR Advisory Pte. Ltd | 14C7279
Gan Kai Le | R23112683
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Job Summary
- Published on: 14 Aug, 2026
- Category: Others
- Vacancy: 1
- Job type: Full Time
- Salary: 10000
- Location: On site
- Job Nature: Full Time
Company Details
- Name: THE SUPREME HR ADVISORY PTE. LTD.
- UEN: 201426535W
- Location: Singapore