Editorial summary

The company is seeking an Application/Process Engineer specializing in die bond tools to lead the design, development, and optimization of software and hardware applications for advanced die bonding processes. The role involves analyzing customer requirements, troubleshooting process and tool issues, and implementing corrective actions to improve stability and performance. Candidates should have experience in semiconductor packaging solutions, process optimization, and failure analysis. The position offers a salary of 6,000.

This summary is AI-generated and may contain inaccuracies. Please refer to the full job description below.

Job description

[This job https://singapore.job-q.com/jobs/detail/application-process-engineer-die-bond-tools-34028 first appeared in Job-Q.com on 23 Sep 2026]

Key Responsibilities:

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Qualifications:

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Excellent communication and interpersonal skills; ability to work independently and in cross-functional teams.
• Willingness to travel for customer support and on-site installations (as required).

Interested applicants, please Email,

Fabian Ling Tuong Liing

R25129353

Recruit Express Pte Ltd

EA Licence No: 99C4599

We regret that only shortlisted candidates will be contacted.

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